The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 26, 2024

Filed:

Jul. 16, 2021
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Bo-Hsun Pan, New Taipei, TW;

Hung-Yu Chou, Taipei, TW;

Chung-Hao Lin, Taipei, TW;

Yuh-Harng Chien, New Taipei, TW;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/56 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/28 (2006.01);
U.S. Cl.
CPC ...
H01L 24/48 (2013.01); H01L 21/4828 (2013.01); H01L 21/565 (2013.01); H01L 23/28 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48177 (2013.01);
Abstract

An integrated circuit and method of making an integrated circuit is provided. The integrated circuit includes an electrically conductive pad having a generally planar top surface that includes a cavity having a bottom surface and sidewalls extending from the bottom surface of the cavity to the top surface of the pad. An electronic device is attached to the top surface of the electrically conductive pad. A wire bond is attached from the electronic device to the bottom surface of the cavity. A molding compound encapsulates the electronic device.


Find Patent Forward Citations

Loading…