The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 08, 2020
Filed:
Dec. 28, 2017
Applicant:
Texas Instruments Incorporated, Dallas, TX (US);
Inventors:
Assignee:
TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/544 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49544 (2013.01); H01L 23/49541 (2013.01); H01L 23/544 (2013.01); H01L 24/78 (2013.01); H01L 24/85 (2013.01); H01L 25/0655 (2013.01); H01L 23/4952 (2013.01); H01L 23/49503 (2013.01); H01L 23/49575 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 2223/54426 (2013.01); H01L 2224/05554 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/49113 (2013.01); H01L 2224/78704 (2013.01); H01L 2224/85122 (2013.01); H01L 2224/85136 (2013.01); H01L 2224/85201 (2013.01); H01L 2224/85203 (2013.01); H01L 2224/85205 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/35 (2013.01); H01L 2924/37001 (2013.01); H01L 2924/386 (2013.01);
Abstract
Aspects of the disclosure relate generally to semiconductor packaging, and specifically to semiconductor device having a lead frame having a semiconductor supporting die pad that is capable of engaging with a wire bonding clamp.