Hung-Jen Lee

Title: The Innovative Mind of Hung-Jen Lee

Introduction

Hung-Jen Lee is an accomplished inventor residing in Taipei, Taiwan. With a total of six patents to his name, Lee has made significant contributions to the field of semiconductor packaging technology. His latest innovations showcase his dedication to advancing the efficiency and functionality of chip packages.

Latest Patents

Lee's most recent patents include two groundbreaking inventions. The first is a "Chip Package Structure and Manufacturing Method Thereof." This invention provides a specialized method for creating a chip package structure, which includes a first substrate with predetermined scribe lines defining various device regions. The innovation involves bonding a second substrate to the first, using a spacing layer that includes chip support rings and a cutting support structure, ultimately allowing for the formation of multiple chip packages.

The second notable patent is the "Semiconductor Package and Fabrication Method Thereof." This patent describes a semiconductor package that features a chip with two portions, including a through hole for exposing part of its first portion. This design enables the integration of Micro-Electro-Mechanical Systems (MEMS) into the semiconductor package, eliminating the need to mount electronic elements onto a circuit board, thus saving valuable space.

Career Highlights

Throughout his career, Hung-Jen Lee has worked with several prominent companies in the industry. Notably, he has been associated with Xintec Corporation, where he played a crucial role in advancing semiconductor packaging technologies. His innovative ideas and contributions have been instrumental in developing efficient manufacturing processes in this field.

Collaborations

Lee's collaborations with esteemed colleagues, including Shu-Ming Chang and Tsang-Yu Liu, have fostered a creative environment that encourages the pursuit of cutting-edge inventions. These partnerships have allowed him to leverage shared expertise, further enhancing the impact of his work in semiconductor technology.

Conclusion

Hung-Jen Lee stands out as a pioneering inventor whose six patents reflect his commitment to innovation in the semiconductor packaging industry. His recent patents significantly enhance the functionality and efficiency of chip packages, contributing to the technological advancements that drive the sector forward. As he continues to work collaboratively with other talented professionals, Lee's contributions are sure to shape the future of this dynamic field.