Growing community of inventors

Taipei, Taiwan

Hung-Jen Lee

Average Co-Inventor Count = 5.03

ph-index = 3

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 15

Hung-Jen LeeTsang-Yu Liu (5 patents)Hung-Jen LeeShu-Ming Chang (5 patents)Hung-Jen LeeYen-Shih Ho (5 patents)Hung-Jen LeeChen-Han Chiang (4 patents)Hung-Jen LeeChien-Hung Liu (1 patent)Hung-Jen LeeYing-Nan Wen (1 patent)Hung-Jen LeeHo-Yin Yiu (1 patent)Hung-Jen LeeBai-Yao Lou (1 patent)Hung-Jen LeeWei-Chung Yang (1 patent)Hung-Jen LeeShih-Yi Lee (1 patent)Hung-Jen LeeHung-Jen Lee (6 patents)Tsang-Yu LiuTsang-Yu Liu (104 patents)Shu-Ming ChangShu-Ming Chang (87 patents)Yen-Shih HoYen-Shih Ho (72 patents)Chen-Han ChiangChen-Han Chiang (6 patents)Chien-Hung LiuChien-Hung Liu (158 patents)Ying-Nan WenYing-Nan Wen (33 patents)Ho-Yin YiuHo-Yin Yiu (27 patents)Bai-Yao LouBai-Yao Lou (15 patents)Wei-Chung YangWei-Chung Yang (14 patents)Shih-Yi LeeShih-Yi Lee (9 patents)
..
Inventor’s number of patents
..
Strength of working relationships

Company Filing History:

1. Other (4 from 832,891 patents)

2. Xintec Corporation (2 from 200 patents)


6 patents:

1. 9054114 - Chip package structure and manufacturing method thereof

2. 8928098 - Semiconductor package and fabrication method thereof

3. 8791768 - Capacitive coupler packaging structure

4. 8779558 - Chip package structure and manufacturing method thereof

5. 8673686 - Chip package structure and manufacturing method thereof

6. 8409925 - Chip package structure and manufacturing method thereof

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as of
12/31/2025
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