The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 06, 2015
Filed:
Dec. 13, 2012
Xintec Inc., Jhongli, TW;
Hung-Jen Lee, Jhongli, TW;
Shu-Ming Chang, Jhongli, TW;
Tsang-Yu Liu, Jhongli, TW;
Yen-Shih Ho, Jhongli, TW;
Xintec, Inc., Jhongli, TW;
Abstract
A semiconductor package includes: a chip having a first portion and a second portion disposed on the first portion, wherein the second portion has at least a through hole therein for exposing a portion of the first portion, and the first portion and/or the second portion has a MEMS; and an etch stop layer formed between the first portion and the second portion and partially exposed through the through hole of the second portion. The invention allows an electronic element to be received in the through hole so as for the semiconductor package to have integrated functions of the MEMS and the electronic element. Therefore, the need to dispose the electronic element on a circuit board as in the prior art can be eliminated, thereby saving space on the circuit board.