Hung-Chuan Chen

Title: Innovations of Inventor Hung-Chuan Chen

Introduction

Hung-Chuan Chen is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 6 patents. His work focuses on innovative semiconductor package structures that enhance the efficiency and performance of electronic devices.

Latest Patents

One of Hung-Chuan Chen's latest patents is a semiconductor package structure and method for forming the same. This invention includes a first semiconductor die and a second semiconductor die that are positioned adjacent to each other. The first semiconductor die features a first edge, a second edge opposite the first edge, and a first metal layer that is exposed from the second edge. The second semiconductor die has a third edge that is adjacent to the second edge of the first semiconductor die, a fourth edge opposite the third edge, and a second metal layer exposed from the third edge. The first metal layer of the first semiconductor die is electrically connected to the second metal layer of the second semiconductor die, which enhances the overall functionality of the semiconductor package.

Career Highlights

Hung-Chuan Chen has worked with notable companies in the semiconductor industry, including MediaTek Corporation. His experience in these organizations has allowed him to develop and refine his innovative ideas, contributing to advancements in semiconductor technology.

Collaborations

Some of his notable coworkers include Tzy-Tzan Fu and Yi-Jou Lin. Their collaboration has likely played a role in the successful development of various semiconductor technologies.

Conclusion

Hung-Chuan Chen's contributions to semiconductor technology through his patents and collaborations highlight his importance as an inventor in the field. His innovative approaches continue to influence the development of efficient electronic devices.