The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 23, 2021
Filed:
Aug. 28, 2018
Applicant:
Mediatek Inc., Hsin-Chu, TW;
Inventors:
Assignee:
MediaTek Inc., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); G06F 13/40 (2006.01); H01L 23/538 (2006.01); H01L 23/50 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0218 (2013.01); G06F 13/4072 (2013.01); H01L 23/49838 (2013.01); H01L 23/5386 (2013.01); H01L 24/09 (2013.01); H05K 1/0243 (2013.01); H01L 23/50 (2013.01); H01L 2924/1436 (2013.01); H01L 2924/151 (2013.01); H05K 2201/10159 (2013.01);
Abstract
A semiconductor device includes a substrate, a die and multiple conductive traces. The die is mounted on the substrate. The conductive traces are routed on the substrate and connected to the die. The conductive traces at least include a plurality of first conductive traces and a plurality of second conductive traces. The second conductive traces are coupled to a predetermined voltage for providing a shielding pattern. The first conductive traces and the second conductive traces are disposed on the substrate in a substantially interlaced pattern.