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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11342267 B1

PDFFull Text
Date of Patent:
May. 24, 2022

Filed:

Oct. 23, 2019

Semiconductor package structure and method for forming the same

Applicant:

Mediatek Inc., Hsinchu, TW;

Inventors:

Po-Hao Chang, Hsinchu, TW;

Yi-Jou Lin, Hsinchu, TW;

Hung-Chuan Chen, Hsinchu, TW;

Assignee:

MediaTek Inc., Hsin-Chu, TW;

Attorney:

Wolf, Greenfield & Sacks, P.C.

Primary Examiner:

Kenneth Parker

Assistant Examiner:

Long H Le

Int. Cl.
CPC ...
H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/538 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5381 (2013.01); H01L 21/4857 (2013.01); H01L 21/561 (2013.01); H01L 21/568 (2013.01); H01L 23/3128 (2013.01); H01L 23/5383 (2013.01); H01L 24/16 (2013.01); H01L 25/0655 (2013.01); H01L 25/50 (2013.01); H01L 2224/16227 (2013.01);
Abstract

A semiconductor package structure includes a first semiconductor die and a second semiconductor die neighboring the first semiconductor die. The first semiconductor die includes a first edge, a second edge opposite the first edge, and a first metal layer exposed from the second edge. The second semiconductor includes a third edge neighboring the second edge of the first semiconductor die, a fourth edge opposite the third edge, and a second metal layer exposed from the third edge. The first metal layer of the first semiconductor die is electrically connected to the second metal layer of the second semiconductor die.

Find Patent Forward Citations

Chang, Po-Hao. (2022). Semiconductor package structure and method for forming the same (U.S. Patent No. 11342267). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11342267

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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