Company Filing History:

6 out of 7,088

United Microelectronics Corp.

patents

Years Active: 2015-2019

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6 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 10446489 - Interconnect structure (2019-10-15),

2. 10153231 - Interconnect structure and fabrication method thereof (2018-12-11),

3. 10079177 - Method for forming copper material over substrate (2018-09-18),

4. 9412653 - Through silicon via (TSV) process (2016-08-09),

5. 9136170 - Through silicon via (TSV) structure and process thereof (2015-09-15),

6. 9012324 - Through silicon via process (2015-04-21),

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