Huan Liu is a prominent inventor based in Shenzhen, China, known for his significant contributions to ultrasonic technology. With a total of 16 patents to his name, Liu has made remarkable advancements in the field, particularly in the development of wafer-level ultrasonic chip modules.

Latest Patents

Liu's latest patents include innovative designs for wafer-level ultrasonic chip modules. One of his notable inventions is a wafer-level ultrasonic chip module that features a substrate with a through slot, a composite layer, a conducting material, and a base material. This design allows for an ultrasonic body to be partially exposed, enhancing its functionality. Another significant patent involves a similar wafer-level ultrasonic chip module that incorporates a groove in the protective layer, facilitating communication with the through slot. These inventions demonstrate Liu's expertise in creating efficient and effective ultrasonic devices.

Career Highlights

Throughout his career, Huan Liu has worked with leading organizations, including Shenzhen China Star Optoelectronics Technology Co., Ltd. and Peking University. His experience in these institutions has allowed him to refine his skills and contribute to groundbreaking research in ultrasonic technology.

Collaborations

Liu has collaborated with notable colleagues such as Yu-Feng Jin and Sheng-Lin Ma. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.

Conclusion

Huan Liu's work in ultrasonic technology has positioned him as a key figure in the field. His patents reflect a commitment to advancing technology and improving the functionality of ultrasonic devices. Liu's contributions continue to influence the industry and inspire future innovations.

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