The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 27, 2021
Filed:
May. 14, 2020
J-metrics Technology Co., Ltd., Taipei, TW;
Peking University Shenzhen Graduate School, Shenzhen, CN;
Yu-Feng Jin, Shenzhen, CN;
Sheng-Lin Ma, Shenzhen, CN;
Qian-Cheng Zhao, Shenzhen, CN;
Yi-Hsiang Chiu, Taipei, TW;
Huan Liu, Shenzhen, CN;
Hung-Ping Lee, Taipei, TW;
Dan Gong, Shenzhen, CN;
J-Metrics Technology Co., Ltd., Taipei, TW;
Peking University Shenzhen Graduate School, Shenzhen, CN;
Abstract
A wafer scale ultrasonic sensing device includes a substrate assembly, an ultrasonic component, a first protective layer, a first conductive circuit, a second conductive circuit, a second protective layer, a conductive material, electrical connection layers, and soldering portions. The substrate assembly includes a first wafer and a second wafer, and the second wafer covers a groove on the first wafer to define a hollow chamber. The first wafer, the second wafer, and the first protective layer are coplanar with the first conductive circuit on a first side surface and coplanar with the second conductive circuit on a second side surface. The second protective layer has an opening, where the conductive material is in the opening and is in contact with the ultrasonic component. The electrical connection layers are on the first side surface and the second side surface, and the soldering portions are respectively connected to the electrical connection layers.