Dan Gong

Title: Dan Gong - Innovator in Ultrasonic Chip Technology

Introduction

Dan Gong is a prominent inventor based in Shenzhen, China. He has made significant contributions to the field of ultrasonic chip technology, holding a total of 5 patents. His innovative work focuses on the development of wafer-level ultrasonic chip modules, which have various applications in modern technology.

Latest Patents

Dan Gong's latest patents include the "Wafer level ultrasonic chip module and manufacturing method thereof." This invention features a substrate with a through slot, a composite layer that includes an ultrasonic body and a protective layer, and a base material. The design allows for the ultrasonic body to be partially exposed, enhancing its functionality. Another notable patent is the "Wafer level ultrasonic chip module having suspension structure and manufacturing method thereof." This patent also incorporates a substrate with a through slot and a composite layer, but it includes a groove that communicates with the through slot, further improving the design and performance of the ultrasonic chip module.

Career Highlights

Throughout his career, Dan Gong has worked with esteemed institutions such as Peking University and J-Metrics Technology Co., Ltd. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking innovations in the field of ultrasonic technology.

Collaborations

Dan has collaborated with notable colleagues, including Sheng-Lin Ma and Yi-Hsiang Chiu. Their combined expertise has fostered a creative environment that has led to the development of advanced technologies in ultrasonic chip modules.

Conclusion

Dan Gong's contributions to ultrasonic chip technology are noteworthy and reflect his dedication to innovation. His patents and collaborations highlight his role as a leading inventor in this specialized field.