The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 28, 2023
Filed:
Feb. 13, 2019
Sonicmems (Zhengzhou) Technology Co., Ltd., Zhengzhou, CN;
Peking University Shenzhen Graduate School, Shenzhen, CN;
Yu-Feng Jin, Shenzhen, CN;
Sheng-Lin Ma, Shenzhen, CN;
Qian-Cheng Zhao, Shenzhen, CN;
Yi-Hsiang Chiu, Taipei, TW;
Huan Liu, Shenzhen, CN;
Hung-Ping Lee, Taipei, TW;
Dan Gong, Shenzhen, CN;
PEKING UNIVERSITY SHENZHEN GRADUATE SCHOOL, Shenzhen, CN;
SONICMEMS (ZHENGZHOU) TECHNOLOGY CO., LTD., Zhengzhou, CN;
Abstract
A wafer level ultrasonic chip module includes a substrate, a composite layer, a conducting material, and a base material. The substrate has a through slot that passes through an upper surface of the substrate and a lower surface of the substrate. The composite layer includes an ultrasonic body and a protective layer. A lower surface of the ultrasonic body is exposed from the through slot. The protective layer covers the ultrasonic body and a partial upper surface of the substrate. The protective layer has an opening, from which a partial upper surface of the ultrasonic body is exposed. The conducting material is in contact with the upper surface of the ultrasonic body. The base material covers the through slot, such that a space is formed among the through slot, the lower surface of the ultrasonic body and an upper surface of the base material.