Company Filing History:
4 out of 611 
3 out of 15 
3 out of 3 Years Active: 2021-2023
Title: Innovations of Inventor Hung-Ping Lee
Introduction
Hung-Ping Lee is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of ultrasonic devices, holding a total of six patents. His work focuses on advanced manufacturing methods and innovative designs that enhance the functionality of ultrasonic technology.
Latest Patents
Among his latest patents is the "Wafer Level Ultrasonic Device and Manufacturing Method Thereof." This invention features a composite layer that includes an ultrasonic element and a protective layer. The device is designed with a first conductive layer and a second conductive layer, which are connected to electrodes through specific channels. The base of the device forms a closed cavity, ensuring efficient operation.
Another significant patent is the "Wafer Level Ultrasonic Chip Module and Manufacturing Method Thereof." This module includes a substrate with a through slot, allowing for the exposure of the ultrasonic body. The protective layer covers the ultrasonic body and part of the substrate, while a conducting material ensures proper electrical contact. This innovative design enhances the performance and reliability of ultrasonic applications.
Career Highlights
Hung-Ping Lee has worked with prestigious institutions such as Peking University and J-Metrics Technology Co., Ltd. His experience in these organizations has contributed to his expertise in ultrasonic technology and patent development.
Collaborations
He has collaborated with talented individuals like Yi-Hsiang Chiu and Yu-Feng Jin, further enriching his work and expanding the scope of his inventions.
Conclusion
Hung-Ping Lee's contributions to ultrasonic technology through his patents demonstrate his innovative spirit and dedication to advancing the field. His work continues to influence the development of new technologies in this area.