The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 19, 2020
Filed:
Aug. 20, 2018
J-metrics Technology Co., Ltd., Shenzhen, Guangdong, CN;
Peking University Shenzhen Graduate School, Shenzhen, CN;
Yu-Feng Jin, Shenzhen, CN;
Sheng-Lin Ma, Shenzhen, CN;
Qian-Cheng Zhao, Shenzhen, CN;
Huan Liu, Shenzhen, CN;
Yi-Hsiang Chiu, Shenzhen, CN;
J-METRICS TECHNOLOGY CO., LTD., Shenzhen, Guangdong, CN;
PEKING UNIVERSITY SHENZHEN GRADUATE SCHOOL, Shenzhen, CN;
Abstract
An ultrasonic module and a manufacturing method for ultrasonic module are provided. The ultrasonic module includes a substrate, a composite layer, and a covering layer. The substrate has an upper surface. The composite layer has a top surface, a bottom surface, and a recessed surface recessed toward the bottom surface. The bottom surface is on the upper surface of the substrate. One or more space is formed between the recessed surface and the upper surface. The composite layer has one or more first groove extending from the top surface toward the recessed surface. The first groove separates the composite layer into a circuit structure and an ultrasonic structure connected to the circuit structure. The covering layer is assembled on the top surface of the composite layer.