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For the Inventor, By the Inventor

Fremont, CA, United States of America

Hsin-Shih Wang

This inventor holds 7 USPTO granted patents. Top assignee: Faraday Technology Corporation. Active years: 2004-2011.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hsin-Shih Wang. Retrieved from https://idiyas.com/inventor/hsin-shih-wang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 7

% Patents Active = 57.1

Average Co-Inventor Count = 1.8

ph-index = 3

Forward Citations = 205(Granted Patents)


Company Filing History:

goldMedal7 out of 411 
 
Faraday Technology Corporation
 patents

Years Active: 2004-2011

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7 patents (USPTO):Explore Patents
1. 8068349 - Power supply architecture for structural ASIC (2011-11-29),
2. 7615412 - System in package (SIP) integrated circuit and packaging method thereof (2009-11-10),
3. 7291930 - Input and output circuit of an integrated circuit chip (2007-11-06),
4. 7287320 - Method for programming a routing layout design through one via layer (2007-10-30),
5. 7185307 - Method of fabricating and integrated circuit through utilizing metal layers to program randomly positioned basic units (2007-02-27),
6. 6902957 - Metal programmable integrated circuit capable of utilizing a plurality of clock sources and capable of eliminating clock skew (2005-06-07),
7. 6819579 - Integrated content addressable memory architecture (2004-11-16),

Title: Hsin-Shih Wang: Innovator in Power Supply Architecture and Integrated Circuits

Introduction

Hsin-Shih Wang is a prominent inventor based in Fremont, CA, known for his contributions to the field of electrical engineering and integrated circuit design. With a total of 7 patents to his name, Wang has made significant advancements in power supply architecture and system in package (SIP) technologies.

Latest Patents

Wang's latest patents include a "Power supply architecture for structural ASIC" and a "System in package (SIP) integrated circuit and packaging method thereof." The power supply architecture patent describes a design that incorporates a first conductor coupled to a fixed voltage, which passes through two edges of a cell, and a second conductor that connects through a contact. This innovative approach enhances the efficiency of application-specific integrated circuits (ASICs). The SIP integrated circuit patent outlines a method for packaging multiple block dices produced by different processes, allowing for improved electrical connectivity and system integration.

Career Highlights

Hsin-Shih Wang is currently employed at Faraday Technology Corporation, where he continues to push the boundaries of technology in integrated circuits. His work has been instrumental in developing solutions that address the growing demands for efficient power management in electronic devices.

Collaborations

Wang collaborates with talented professionals in his field, including Shang-Jyh Shieh and Ming-Hsin Ku, who contribute to the innovative projects at Faraday Technology Corporation.

Conclusion

Hsin-Shih Wang's contributions to power supply architecture and integrated circuits exemplify the spirit of innovation in the technology sector. His patents reflect a commitment to advancing electronic design and improving system efficiency.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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