The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 10, 2009
Filed:
Sep. 18, 2006
Applicant:
Hsin-shih Wang, Fremont, CA (US);
Inventor:
Hsin-Shih Wang, Fremont, CA (US);
Assignee:
Faraday Technology Corp., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 21/48 (2006.01); H01L 21/50 (2006.01);
U.S. Cl.
CPC ...
Abstract
The present invention discloses a system in package (SIP) integrated circuit and a packaging method thereof. The SIP integrated circuit includes one or more first block dices produced by a first process and one or more second block dices produced by a second process. The first block dices are electrically connected to the second block dices. The first block dices and the second block dices are packaged into a system.
Wang, Hsin-Shih. (2009). System in package (sip) integrated circuit and packaging method thereof (U.S. Patent No. 7615412). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7615412
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile