Fremont, CA, United States of America

Hsien-Chung Lin

This inventor holds 19 USPTO granted patents and 7 published patent applications, primarily in Robotic Motion Planning. Top assignee: Fanuc Corporation. Active years: 2022-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hsien-Chung Lin. Retrieved from https://idiyas.com/inventor/hsien-chung-lin

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 19 

% Patents Active = 78.9

Average Co-Inventor Count = 2.5

ph-index = 2

Forward Citations = 31(Granted Patents)


Company Filing History:


Years Active: 2022-2026

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Areas of Expertise:
Collision Avoidance
Dynamic Motion Planning
Robotic Optimization
Torque-Rate Control
Vibration Suppression
Interference Check
Motion Tapping Method
Path Planning
Robot Harnessing
Distance Field
Swept Volume Deformation
Dynamic Velocity Modification
19 patents (USPTO):Explore Patents

Title: The Innovative Journey of Hsien-Chung Lin

Introduction: Hsien-Chung Lin, a talented inventor based in Fremont, CA, has made significant contributions to the field of technology with his groundbreaking innovations.

Latest Patents: Lin's latest patents include advancements in artificial intelligence algorithms for autonomous vehicles and cutting-edge solutions for renewable energy storage systems.

Career Highlights: With a career spanning over two decades, Lin has worked with top tech companies in Silicon Valley, leading research teams and spearheading projects that have revolutionized various industries.

Collaborations: Throughout his career, Lin has collaborated with renowned scientists, engineers, and researchers from prestigious universities and research institutions worldwide, fostering a culture of innovation and excellence.

Conclusion: Hsien-Chung Lin's passion for innovation and his relentless pursuit of technological advancement continue to inspire the next generation of inventors and shape the future of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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