The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 21, 2025

Filed:

Oct. 15, 2021
Applicant:

Fanuc Corporation, Yamanashi, JP;

Inventors:

Hsien-Chung Lin, Fremont, CA (US);

Tetsuaki Kato, Fremont, CA (US);

Assignee:

FANUC CORPORATION, Yamanashi, JP;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B25J 9/16 (2006.01); B25J 13/08 (2006.01);
U.S. Cl.
CPC ...
B25J 9/1666 (2013.01); B25J 9/1651 (2013.01); B25J 9/1676 (2013.01); B25J 9/1682 (2013.01); B25J 13/08 (2013.01); G05B 2219/34216 (2013.01); G05B 2219/39001 (2013.01);
Abstract

A method and system for robotic motion planning which perform dynamic velocity attenuation to avoid robot collision with static or dynamic objects. The technique maintains the planned robot tool path even when speed reduction is necessary, by providing feedback of a computed slowdown ratio to a tracking controller so that the path computation is always synchronized with current robot speed. The technique uses both robot-obstacle distance and relative velocity to determine when to apply velocity attenuation, and computes a joint speed limit vector based on a robot-obstacle distance, a maximum obstacle speed, and a computed stopping time as a function of the joint speed. Two different control structure implementations are disclosed, both of which provide feedback of the slowdown ratio to the motion planner as needed for faithful path following. A method of establishing velocity attenuation priority in multi-robot systems is also provided.


Find Patent Forward Citations

Loading…