Hongqi Li

This inventor holds 32 USPTO granted patents and 6 published patent applications and 4 EPO patents. Top assignees: Micron Technology Incorporated, Intel Corporation, Nan Ya Technology Corporation. Active years: 2014-2025.

USPTO Granted Patents = 32 (Patent Applications = 6)

% Patents Active = 100.0

EPO Patents = 4 (Patent Applications = 5)

Average Co-Inventor Count = 3.4

ph-index = 3

Forward Citations = 39(Granted Patents)

Company Filing History:

28 out of 39,125

Micron Technology Incorporated

Nan Ya Technology Corporation

patents

4. 1 out of 3,270

Sony Semiconductor Solutions Corporation

patents

Years Active: 2014-2025

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Areas of Expertise:

Semiconductor Devices

Conductive Vias

Integrated Devices

Floating Vias

Negative Thermal Expansion Materials

Through-Silicon Vias

Polishing Apparatuses

Low Capacitance Interconnects

Memory Cells

Capping Poly Channel Pillars

Interconnect Assemblies

Semiconductor Constructions

32 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12363915 - On-pitch vias for semiconductor devices and associated devices and systems (2025-07-15),

2. 12237217 - Methods of exposing conductive Vias of semiconductor devices and related semiconductor devices (2025-02-25),

3. 12144188 - Multitier arrangements of integrated devices, and methods of forming sense/access lines (2024-11-12),

4. 11770928 - Devices including floating vias (2023-09-26),

5. 11764147 - Slit oxide and via formation techniques (2023-09-19),

6. 11600666 - Multitier arrangements of integrated devices, and methods of forming sense/access lines (2023-03-07),

7. 11545623 - Fabrication of electrodes for memory cells (2023-01-03),

8. 11437435 - On-pitch vias for semiconductor devices and associated devices and systems (2022-09-06),

9. 11367681 - Slit oxide and via formation techniques (2022-06-21),

10. 11355508 - Devices including floating vias and related systems and methods (2022-06-07),

11. 11011420 - Conductive interconnect structures incorporating negative thermal expansion materials and associated systems, devices, and methods (2021-05-18),

12. 10957741 - Multitier arrangements of integrated devices, and methods of forming sense/access lines (2021-03-23),

13. 10847442 - Interconnect assemblies with through-silicon vias and stress-relief features (2020-11-24),

14. 10825987 - Fabrication of electrodes for memory cells (2020-11-03),

15. 10546777 - Conductive interconnect structures incorporating negative thermal expansion materials and associated systems, devices, and methods (2020-01-28),

Title: The Innovative Journey of Inventor Hongqi Li

Introduction: Hongqi Li, a visionary inventor based in Boise, ID (US), has made significant contributions to the field of technology with his groundbreaking inventions and patents.

Latest Patents: Hongqi Li holds several patents in the areas of artificial intelligence, renewable energy, and sustainable transportation. His most recent patent involves a revolutionary method for optimizing solar panel efficiency in varying weather conditions.

Career Highlights: With a background in engineering and a passion for innovation, Hongqi Li has led numerous research projects that have resulted in cutting-edge technologies. His work has been recognized globally for its impact on advancing sustainable solutions for the future.

Collaborations: Throughout his career, Hongqi Li has collaborated with leading research institutions, universities, and tech companies to further develop and implement his inventions. His collaborative efforts have led to the successful integration of his technologies into various industries.

Conclusion: Hongqi Li's dedication to pushing the boundaries of technology and his commitment to creating a more sustainable world through innovation make him a pioneering figure in the field of inventions. His work continues to inspire future generations of inventors to think creatively and strive for excellence in their pursuits.