Hironori Shizuhata

Title: Hironori Shizuhata: Innovator in Adhesive Technology

Introduction

Hironori Shizuhata is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of adhesive technology, particularly in applications related to semiconductor devices. With a total of 6 patents to his name, Shizuhata continues to push the boundaries of innovation in his field.

Latest Patents

Shizuhata's latest patents focus on adhesive compositions and sheets designed for semiconductor devices. One notable patent describes an adhesive composition that includes an acrylic polymer, an epoxy thermosetting resin with an unsaturated hydrocarbon group, and a thermosetting agent. This innovative adhesive composition is engineered to achieve high reliability in packages where semiconductor chips of reduced thickness are mounted, even under severe reflow conditions. Additionally, he has developed an adhesive sheet that incorporates this advanced adhesive composition, further enhancing the performance of semiconductor devices.

Career Highlights

Hironori Shizuhata is currently associated with Lintec Corporation, where he applies his expertise in adhesive technology. His work has been instrumental in advancing the reliability and efficiency of semiconductor packaging solutions. His innovative approaches have garnered attention in the industry, establishing him as a key figure in adhesive research and development.

Collaborations

Shizuhata has collaborated with notable colleagues such as Naoya Saiki and Isao Ichikawa. These partnerships have contributed to the successful development of his patented technologies and have fostered a collaborative environment for innovation.

Conclusion

Hironori Shizuhata's contributions to adhesive technology, particularly in the semiconductor industry, highlight his role as a leading inventor. His innovative patents and collaborations continue to shape the future of adhesive applications.