The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 30, 2010
Filed:
May. 23, 2007
Naoya Saiki, Itabashi-ku, JP;
Isao Ichikawa, Itabashi-ku, JP;
Hironori Shizuhata, Itabashi-ku, JP;
Osamu Yamazaki, Itabashi-ku, JP;
Naoya Saiki, Itabashi-ku, JP;
Isao Ichikawa, Itabashi-ku, JP;
Hironori Shizuhata, Itabashi-ku, JP;
Osamu Yamazaki, Itabashi-ku, JP;
Lintec Corporation, Tokyo, JP;
Abstract
The adhesive composition according to the present invention is characterized by including an acrylic copolymer (A), an epoxy thermosetting resin (B) and a compound (C) having a functional group which can react with an epoxy group and having an unsaturated hydrocarbon group. According to the present invention, the high package reliability can be achieved even when exposed to severe reflow conditions in a package in which a thin semiconductor chip is mounted.