The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 09, 2010
Filed:
Jun. 24, 2008
Applicants:
Naoya Saiki, Tokyo, JP;
Isao Ichikawa, Tokyo, JP;
Hironori Shizuhata, Tokyo, JP;
Inventors:
Assignee:
Lintec Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/30 (2006.01); C08L 33/14 (2006.01); C08L 33/10 (2006.01);
U.S. Cl.
CPC ...
Abstract
An adhesive sheet which can actualize a high package reliability wherein there is no separation at the adhesive interface and no package cracking, in a package in which a semiconductor chip being reduced in thickness is mounted under severe reflow conditions after exposure to a hot and humid environment. The adhesive sheet includes a base material and, formed thereon, an adhesive layer having an adhesive composition including an acrylic copolymer (A) containing 20 to 95% by weight of a structural unit derived from a benzyl (meth)acrylate, an epoxy thermosetting resin (B), and a thermosetting agent (C).