The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 21, 2012
Filed:
Dec. 23, 2008
Naoya Saiki, Tokyo, JP;
Hironori Shizuhata, Tokyo, JP;
Isao Ichikawa, Tokyo, JP;
Lintec Corporation, Tokyo, JP;
Abstract
The object of the present invention is to provide an adhesive composition which can form a thinner adhesive layer, which has good storage stability and which can actualize high package reliability even when exposed to severe reflow conditions in a semiconductor package in which a semiconductor chip being reduced in a thickness is mounted, and an adhesive sheet having an adhesive layer comprising the adhesive composition. The adhesive composition of the present invention comprises an epoxy thermosetting resin (A), a thermosetting agent (B) and a thermosetting accelerating agent (C); the thermosetting accelerating agent (C) being soluble in methyl ethyl ketone and inactive as a thermosetting accelerating agent at room temperature.