The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 07, 2017
Filed:
Sep. 29, 2015
Applicant:
Lintec Corporation, Tokyo, JP;
Inventors:
Naoya Saiki, Tokyo, JP;
Isao Ichikawa, Tokyo, JP;
Hironori Shizuhata, Tokyo, JP;
Osamu Yamazaki, Tokyo, JP;
Assignee:
Lintec Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 133/08 (2006.01); C09J 163/10 (2006.01); C08L 33/08 (2006.01); C08L 63/10 (2006.01); C08L 63/00 (2006.01); C08K 5/07 (2006.01); C08K 5/103 (2006.01); C08K 5/29 (2006.01); C08K 5/00 (2006.01); H01L 21/683 (2006.01); H01L 23/495 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
C09J 133/08 (2013.01); C08K 5/0025 (2013.01); C08K 5/07 (2013.01); C08K 5/103 (2013.01); C08K 5/29 (2013.01); C08L 33/08 (2013.01); C08L 63/10 (2013.01); C09J 163/10 (2013.01); H01L 21/6836 (2013.01); H01L 23/49513 (2013.01); H01L 24/27 (2013.01); H01L 24/31 (2013.01); H01L 24/83 (2013.01); C08L 63/00 (2013.01); C08L 2205/03 (2013.01); C09J 2203/326 (2013.01); C09J 2205/102 (2013.01); C09J 2433/00 (2013.01); C09J 2461/00 (2013.01); C09J 2463/00 (2013.01); H01L 2221/68327 (2013.01); H01L 2224/274 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/83855 (2013.01); H01L 2924/0102 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01019 (2013.01); H01L 2924/01025 (2013.01); H01L 2924/01027 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01045 (2013.01); H01L 2924/01077 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/0665 (2013.01); H01L 2924/07802 (2013.01); H01L 2924/09701 (2013.01); H01L 2924/10329 (2013.01); H01L 2924/12044 (2013.01); H01L 2924/14 (2013.01); H01L 2924/181 (2013.01); Y10T 428/287 (2015.01); Y10T 428/2809 (2015.01); Y10T 428/2813 (2015.01); Y10T 428/2891 (2015.01);
Abstract
An adhesive composition is described, which includes an acrylic polymer, an epoxy thermosetting resin having an unsaturated hydrocarbon group, and a thermosetting agent. The adhesive composition achieves high reliability in a package in which a semiconductor chip of reduced thickness is mounted even when exposed to severe reflow conditions. An adhesive sheet having an adhesive layer that includes the above adhesive composition is also described.