Tochigi, Japan

Hironobu Moriyama

This inventor holds 11 USPTO granted patents and 1 published patent application and 2 EPO patents. Top assignees: Dexerials Corporation, Sony Chemical & Information Device Corporation, Sony Corporation. Active years: 2008-2019.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hironobu Moriyama. Retrieved from https://idiyas.com/inventor/hironobu-moriyama

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 11 

% Patents Active = 100.0

 

Average Co-Inventor Count = 1.9

ph-index = 2

Forward Citations = 16(Granted Patents)


Location History:

  • Tokyo, JP (2014 - 2017)
  • Tochigi, JP (2008 - 2019)

Company Filing History:


Years Active: 2008-2019

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11 patents (USPTO):Explore Patents

Title: Hironobu Moriyama: Innovator in Semiconductor Technology

Introduction

Hironobu Moriyama is a prominent inventor based in Tochigi, Japan, known for his significant contributions to semiconductor technology. With a total of 11 patents to his name, Moriyama has made remarkable advancements in the field, particularly in the development of protective tapes used in semiconductor manufacturing.

Latest Patents

Moriyama's latest patents focus on innovative protective tapes and methods for manufacturing semiconductor devices. One of his notable inventions is a protective tape that includes an adhesive agent layer, a thermoplastic resin layer, and a matrix film layer. This tape is designed to be applied to the surface of a wafer with a bump electrode, allowing for efficient grinding and dicing of the wafer to obtain individual semiconductor chips. The adhesive agent layer, after curing, exhibits a shear storage modulus ranging from 3.0E+08 Pa to 5.0E+09 Pa, ensuring optimal performance during the manufacturing process. Another patent emphasizes a protective tape that enhances solder bonding properties while minimizing wafer warping, satisfying specific conditions related to the shear storage modulus and thickness of the thermoplastic resin layers.

Career Highlights

Throughout his career, Hironobu Moriyama has worked with notable companies such as Dexerials Corporation and Sony Corporation. His experience in these organizations has allowed him to refine his expertise in semiconductor technology and contribute to various innovative projects.

Collaborations

Moriyama has collaborated with talented individuals in the industry, including Yasuhiro Fujita and Kouki Hatsuda. These partnerships have fostered a creative environment that has led to the development of groundbreaking technologies in the semiconductor field.

Conclusion

Hironobu Moriyama's contributions to semiconductor technology through his innovative patents and collaborations highlight his status as a leading inventor in the industry. His work continues to influence advancements in manufacturing processes and materials used in semiconductor devices.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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