The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 22, 2017
Filed:
Aug. 18, 2014
Applicant:
Dexerials Corporation, Tokyo, JP;
Inventors:
Hironobu Moriyama, Tokyo, JP;
Shingo Deguchi, Tokyo, JP;
Hidekazu Yagi, Tokyo, JP;
Tomoyuki Ishimatsu, Tokyo, JP;
Assignee:
DEXERIALS CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/78 (2006.01); H01L 21/683 (2006.01); B32B 27/00 (2006.01); C09J 7/02 (2006.01); H01L 21/304 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6836 (2013.01); B32B 27/00 (2013.01); C09J 7/02 (2013.01); H01L 21/304 (2013.01); H01L 21/78 (2013.01); H01L 23/3142 (2013.01); H01L 2224/13 (2013.01); H01L 2924/0002 (2013.01);
Abstract
A protective tape and a method for manufacturing a semiconductor device using the same capable of achieving excellent connection properties. The protective tape includes an adhesive layer, a thermoplastic resin layer and a backing material film in that order; a modulus ratio of a shear storage modulus of the adhesive layer to a shear storage modulus of the thermoplastic resin layer at an application temperature at which the protective tape is applied is 0.01 or less. This suppresses resin residue on bumps thereby achieving excellent connection properties.