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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9741598 B1

PDFFull Text
Date of Patent:
Aug. 22, 2017

Filed:

Aug. 18, 2014

Protective tape and method for manufacturing a semiconductor device using the same

Applicant:

Dexerials Corporation, Tokyo, JP;

Inventors:

Hironobu Moriyama, Tokyo, JP;

Shingo Deguchi, Tokyo, JP;

Hidekazu Yagi, Tokyo, JP;

Tomoyuki Ishimatsu, Tokyo, JP;

Assignee:

DEXERIALS CORPORATION, Tokyo, JP;

Attorney:

Oliff PLC

Primary Examiner:

Duy T Nguyen

Assistant Examiner:

Bo Bin Jang

Int. Cl.
CPC ...
H01L 21/78 (2006.01); H01L 21/683 (2006.01); B32B 27/00 (2006.01); C09J 7/02 (2006.01); H01L 21/304 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6836 (2013.01); B32B 27/00 (2013.01); C09J 7/02 (2013.01); H01L 21/304 (2013.01); H01L 21/78 (2013.01); H01L 23/3142 (2013.01); H01L 2224/13 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A protective tape and a method for manufacturing a semiconductor device using the same capable of achieving excellent connection properties. The protective tape includes an adhesive layer, a thermoplastic resin layer and a backing material film in that order; a modulus ratio of a shear storage modulus of the adhesive layer to a shear storage modulus of the thermoplastic resin layer at an application temperature at which the protective tape is applied is 0.01 or less. This suppresses resin residue on bumps thereby achieving excellent connection properties.

Find Patent Forward Citations

Moriyama, Hironobu. (2017). Protective tape and method for manufacturing a semiconductor device using the same (U.S. Patent No. 9741598). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9741598

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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