Hidekazu Yagi

Title: Innovations by Hidekazu Yagi

Introduction

Hidekazu Yagi is a notable inventor based in Tochigi, Japan. He has made significant contributions to the field of semiconductor technology, particularly through his innovative patents. With a total of two patents to his name, Yagi has focused on developing protective tape that enhances the manufacturing process of semiconductor devices.

Latest Patents

Yagi's latest patents include a protective tape and a method for manufacturing semiconductor devices using this tape. The first patent describes a protective tape that improves solder bonding properties and reduces wafer warping. This protective tape consists of an adhesive agent layer, a first thermoplastic resin layer, a second thermoplastic resin layer, and a matrix film layer. The design of the tape meets specific conditions that enhance its performance. The second patent also focuses on a protective tape and a method for manufacturing semiconductor devices, emphasizing excellent connection properties. This version includes an adhesive layer, a thermoplastic resin layer, and a backing material film, achieving a modulus ratio that minimizes resin residue on bumps, thereby improving connection quality.

Career Highlights

Hidekazu Yagi is currently employed at Dexerials Corporation, where he continues to innovate in the semiconductor field. His work has been instrumental in advancing the technology used in semiconductor manufacturing, making processes more efficient and reliable.

Collaborations

Yagi has collaborated with notable coworkers, including Hironobu Moriyama and Tomoyuki Ishimatsu. Their combined expertise contributes to the innovative environment at Dexerials Corporation.

Conclusion

Hidekazu Yagi's contributions to semiconductor technology through his patents demonstrate his commitment to innovation. His work not only enhances manufacturing processes but also sets a standard for future developments in the industry.