The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 04, 2019
Filed:
Jun. 03, 2016
Dexerials Corporation, Tokyo, JP;
Hironobu Moriyama, Tochigi, JP;
Hidekazu Yagi, Tochigi, JP;
Tomoyuki Ishimatsu, Tochigi, JP;
Katsuyuki Ebisawa, Tochigi, JP;
Keiji Honjyo, Tochigi, JP;
Junichi Kaneko, Tochigi, JP;
DEXERIALS CORPORATION, Tokyo, JP;
Abstract
A protective tape that improves solder bonding properties and reduces wafer warping. The protective tape includes, in the following order, an adhesive agent layer, a first thermoplastic resin layer, a second thermoplastic resin layer, and a matrix film layer. The protective tape satisfies the conditions expressed by the following formulae (1) to (3):  (1)  (2)()/()≤1.4E+06 Pa.  (3)Ga represents a shear storage modulus of the first thermoplastic resin layer at a pasting temperature at which the protective tape is pasted; Gb represents a shear storage modulus of the second thermoplastic resin layer at the pasting temperature at which the protective tape is pasted; Ta represents a thickness of the first thermoplastic resin layer; and Tb represents a thickness of the second thermoplastic resin layer.