Dexerials Corporation

Hidekazu Yagi

Tomoyuki Ishimatsu

Hironobu Moriyama

Keiji Honjyo

Junichi Kaneko

Katsuyuki Ebisawa

Shingo Deguchi

A protective tape that improves solder bonding properties and reduces wafer warping. The protective tape includes, in the following order, an adhesive agent layer, a first thermoplastic resin layer, a second thermoplastic resin layer, and a matrix film layer. The protective tape satisfies the conditions expressed by the following formulae (1) to (3):&#x2003;&#x2003;(1)&#x2003;&#x2003;(2)()/()&#x2264;1.4E+06 Pa.&#x2003;&#x2003;(3)Ga represents a shear storage modulus of the first thermoplastic resin layer at a pasting temperature at which the protective tape is pasted; Gb represents a shear storage modulus of the second thermoplastic resin layer at the pasting temperature at which the protective tape is pasted; Ta represents a thickness of the first thermoplastic resin layer; and Tb represents a thickness of the second thermoplastic resin layer.

Protective tape and method for manufacturing semiconductor device using the same

A protective tape and a method for manufacturing a semiconductor device using the same capable of achieving excellent connection properties. The protective tape includes an adhesive layer, a thermoplastic resin layer and a backing material film in that order; a modulus ratio of a shear storage modulus of the adhesive layer to a shear storage modulus of the thermoplastic resin layer at an application temperature at which the protective tape is applied is 0.01 or less. This suppresses resin residue on bumps thereby achieving excellent connection properties.

Protective tape and method for manufacturing a semiconductor device using the same

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Tochigi, Japan

Hidekazu Yagi