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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10483148 B1

PDFFull Text
Date of Patent:
Nov. 19, 2019

Filed:

Oct. 18, 2016

Protective tape and method for manufacturing semiconductor device

Applicant:

Dexerials Corporation, Tokyo, JP;

Inventor:

Hironobu Moriyama, Tochigi, JP;

Assignee:

DEXERIALS CORPORATION, Tokyo, JP;

Attorney:

Oliff PLC

Primary Examiner:

Farun Lu

Int. Cl.
CPC ...
H01L 21/683 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 21/78 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6836 (2013.01); H01L 21/56 (2013.01); H01L 21/563 (2013.01); H01L 21/78 (2013.01); H01L 23/29 (2013.01); H01L 23/31 (2013.01); H01L 23/3114 (2013.01); H01L 23/3157 (2013.01); H01L 24/27 (2013.01); H01L 24/73 (2013.01); H01L 24/81 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68336 (2013.01); H01L 2221/68377 (2013.01); H01L 2221/68386 (2013.01); H01L 2224/11 (2013.01); H01L 2224/27003 (2013.01); H01L 2224/73104 (2013.01); H01L 2224/8121 (2013.01); H01L 2224/81815 (2013.01);
Abstract

A protective tape including an adhesive agent layer, a thermoplastic resin layer, and a matrix film layer in this order to a surface of a wafer on which a bump electrode is formed; grinding a surface of the wafer opposite to the surface on which the protective tape is pasted; pasting an adhesive tape to the ground surface of the wafer; peeling the protective tape so that the adhesive agent layer remains and other layers are removed; dicing the wafer to which the adhesive tape is pasted to obtain individual semiconductor chips; and curing the adhesive agent layer before dicing; the adhesive agent layer after curing has a shear storage modulus of 3.0E+08 Pa to 5.0E+09 Pa, and the ratio of the thickness of the adhesive agent layer of the protective tape before pasting to the height of the bump electrode is 1/30 to 1/6.

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