Location History:
- Yamanashi, JP (1992)
- Tokyo, JP (1987 - 2011)
Company Filing History:
28 out of 35,705 
3 out of 2,467 
Years Active: 1987-2011
Title: Innovations of Hirokazu Tohya: Pioneering Via Transmission Lines
Introduction
Hirokazu Tohya, a notable inventor based in Tokyo, Japan, has made significant contributions to the field of multilayer printed circuit boards (PCBs). With an impressive portfolio of 28 patents, Tohya has focused on developing innovative solutions to enhance the performance and efficiency of electronic components.
Latest Patents
Among Hirokazu Tohya's latest patents are two groundbreaking inventions concerning via transmission lines for multilayer printed circuit boards. The first patent describes a via transmission line that utilizes a signal via surrounded by a set of ground vias and ground plates from conductor layers of the multilayer PCB. This innovative design creates an inner conductive boundary and an outer conductive boundary, which work together to minimize frequency-dependent return losses. The clearance hole included in this design contributes to high-performance broadband operation by defining dimensions based on specific arrangements of ground vias.
The second patent presents a compact via transmission line that optimizes the characteristic impedance of printed circuit boards, particularly multilayer designs. This invention features a central conductor and multiple via holes, ensuring effective electrical isolation to prevent crosstalk in high-frequency signal applications. This advancement not only enhances the PCB's miniaturization but also extends the frequency range capabilities of the via transmission line.
Career Highlights
Hirokazu Tohya has had a notable career in the technology sector, primarily working with NEC Corporation and NEC Electronics Corporation. His extensive experience has enabled him to develop innovative solutions that address current challenges within the electronics industry.
Collaborations
Throughout his career, Hirokazu Tohya has collaborated with esteemed professionals such as Shiro Yoshida and Koichiro Masuda. These partnerships have fostered an environment of creativity and innovation, leading to the development of cutting-edge technologies in multilayer printed circuit boards.
Conclusion
Hirokazu Tohya's contributions to the realm of multilayer printed circuit boards and via transmission lines reflect his dedication to advancing electronic technology. With his impressive body of work and collaborations, Tohya continues to be a driving force in the innovation landscape, inspiring future inventors and engineers alike.