The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 06, 2010
Filed:
Oct. 10, 2008
Taras Kushta, Tokyo, JP;
Kaoru Narita, Tokyo, JP;
Takanori Saeki, Kawasaki, JP;
Tomoyuki Kaneko, Kawasaki, JP;
Hirokazu Tohya, Tokyo, JP;
Taras Kushta, Tokyo, JP;
Kaoru Narita, Tokyo, JP;
Takanori Saeki, Kawasaki, JP;
Tomoyuki Kaneko, Kawasaki, JP;
Hirokazu Tohya, Tokyo, JP;
NEC Corporation, Tokyo, JP;
NEC Electronics Corporation, Kanagawa, JP;
Abstract
A compact via transmission line for a printed circuit board having preferred characteristic impedance and capable of miniaturizing the printed circuit board including a multilayer printed circuit board, and extending the frequency range of a via transmission line mounted on the printed circuit board, and a design method of the same. The transmission line has a central conductor forming an inner conductor layer boundary make up a signal via hole, a plurality of via holes arranged around the central conductor form an outer conductor layer boundary, and a plurality of conductor plates formed of a printed circuit board conductor layer, is further provided with a constitutive parameter adjustment clearance hole between the inner and outer conductor layer boundaries of the compact via transmission line, and electrically isolates to prevent cross-talk of a signal propagating through a signal via hole with other signals in a high-frequency signal band.