The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 17, 2005

Filed:

Feb. 04, 2002
Applicants:

Hidehito Matsuyama, Tokyo, JP;

Hirokazu Tohya, Tokyo, JP;

Inventors:

Hidehito Matsuyama, Tokyo, JP;

Hirokazu Tohya, Tokyo, JP;

Assignee:

NEC Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01K017/00 ;
U.S. Cl.
CPC ...
Abstract

A method for generating thermal network data for use in thermal analysis of a coupling structure of a large number of components. Depending on the density of nodes having a position defined by the structure, two-dimensional quadtree area division or three-dimensional octtree area division is performed. A node is provided in the center of the divided area and anode is determined using approximation to a node having a position defined by the structure. Alternatively, an area and a node are determined using Voronoi area division in case of area subdivision where a small area is assigned only to a defined node. Thermal network data is generated by inserting thermal resistances between respective nodes.


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