The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 09, 2009
Filed:
Mar. 11, 2005
Applicants:
Yoshiaki Wakabayashi, Tokyo, JP;
Hirokazu Tohya, Tokyo, JP;
Kouichi Yamaguchi, Kyoto, JP;
Akiji Higuchi, Kyoto, JP;
Kenji Yamada, Kyoto, JP;
Inventors:
Yoshiaki Wakabayashi, Tokyo, JP;
Hirokazu Tohya, Tokyo, JP;
Kouichi Yamaguchi, Kyoto, JP;
Akiji Higuchi, Kyoto, JP;
Kenji Yamada, Kyoto, JP;
Assignee:
NEC Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01P 3/08 (2006.01);
U.S. Cl.
CPC ...
Abstract
A microstrip line element is composed of a first electrode layer () as a substrate which is more of a metal, a dielectric layer () formed by oxidizing, nitriding or oxiynitriding the first electrode layer (), a conductor layer () formed on the dielectric layer () and a second electrode layer () formed on the conductor layer (). The conductor layer () is composed of at least conductive nanoparticles () and a binder resin ().