Nec Corporation

Nec Electronics Corporation

Hirokazu Tohya

Shiro Yoshida

Koichiro Masuda

Takanori Saeki

Takashi Nakano

Kaoru Narita

Tomoyuki Kaneko

Taras Kushta

Hiroshi Wabuka

Yuzo Shimada

Noriaki Ando

Masaharu Satoh

Hitoshi Irino

Satoshi Arai

Atsushi Ochi

Toru Mori

Mitsuo Saito

Norio Masuda

Masayuki Shimizu

Kenji Yamada

Yasushi Kinoshita

Naoya Tamaki

Osamu Myohga

Akiji Higuchi

Kouichi Yamaguchi

Yoshiaki Wakabayashi

Hideki Shimizu

Ryo Maniwa

Hidehito Matsuyama

Tooru Kido

A via transmission line for a multilayer printed circuit board (PCB) in which a wave guiding channel is formed by a signal via or a number of signal vias, an assembly of ground vias surrounding the signal via or corresponding number of coupled signal vias, a set of ground plates from conductor layers of the multilayer PCB, and a clearance hole. In this via transmission line, the signal via, or the number of signal vias forms an inner conductive boundary, ground vias and ground plates from conductor layers of the multilayer PCB form an outer conductive boundary, and the clearance hole provides both isolation of the inner conductive boundary from the outer conductive boundary and high-performance broadband operation of the via transmission line by means of the predetermined clearance hole cross-sectional shape and dimensions where the cross-sectional shape of the clearance hole is defined by the arrangement of ground vias in the outer conductive boundary and dimensions of the clearance hole are determined according to a method to minimize frequency-dependent return losses caused by specific corrugations of the outer conductive boundary formed by ground plates in the wave guiding channel of the via transmission line.

Via transmission lines for multilayer printed circuit boards

A compact via transmission line for a printed circuit board having preferred characteristic impedance and capable of miniaturizing the printed circuit board including a multilayer printed circuit board, and extending the frequency range of a via transmission line mounted on the printed circuit board, and a design method of the same. The transmission line has a central conductor forming an inner conductor layer boundary make up a signal via hole, a plurality of via holes arranged around the central conductor form an outer conductor layer boundary, and a plurality of conductor plates formed of a printed circuit board conductor layer, is further provided with a constitutive parameter adjustment clearance hole between the inner and outer conductor layer boundaries of the compact via transmission line, and electrically isolates to prevent cross-talk of a signal propagating through a signal via hole with other signals in a high-frequency signal band.

Compact via transmission line for printed circuit board and design method of the same

A semiconductor circuit in which low impedance characteristics required for a decoupling circuit are ensured up to a band of several hundreds of MHz or above in the situation where digital circuits are rushing into GHz age, and a semiconductor circuit exhibiting low impedance characteristics even in a band of several hundreds of MHz or above. A line element comprising a power supply line and a ground line or a ground plane arranged oppositely through a dielectric, characterized in that a dielectric covering the line element is provided.

Line component and semiconductor circuit using line component

A microstrip line element is composed of a first electrode layer () as a substrate which is more of a metal, a dielectric layer () formed by oxidizing, nitriding or oxiynitriding the first electrode layer (), a conductor layer () formed on the dielectric layer () and a second electrode layer () formed on the conductor layer (). The conductor layer () is composed of at least conductive nanoparticles () and a binder resin ().

Nanoparticle transmission line element and method of fabricating the same

Compact via transmission line for printed circuit board and its designing method

Electromagnetic waves leaking from a power distribution circuit provided on a printed wiring substrate or in a semiconductor package are suppressed, and degradation of the waveform of a signal generated by a high-speed digital circuit. A strip line device comprises an elongated metal plate () having a valve action and coated with a dielectric film (). A conductive layer () is formed to cover the valve-acting metal, with the dielectric film () interposed therebetween. The characteristic impedance as seen from its input terminal can be low over a wide range.

Strip line device, printed wiring board mounting member, circuit board, semiconductor package, and method of forming same

The present invention is provided with a transmission line element having a ground wiring and a power supply wiring formed interposing an insulating film, on the power supply wiring on a semiconductor chip, lead or printed-circuit board, such that the capacitance per unit length of the transmission line element is boosted to set the characteristic impedance of the transmission line element for the high frequency range to an optimum value. In this way, the power supply wiring inclusive of the transmission line element can have a satisfactory decoupling performance.

Semiconductor device, semiconductor circuit and method for producing semiconductor device

To provide a broadband circuit from which a desired circuit characteristic is stably obtained over a wide frequency band with a small number of circuit devices and which can be easily designed. In the case of the broadband circuit to which a circuit device is connected through a transmission line including a signal transmission conductor, grounding conductor, and dielectric present between these conductors, an LILChaving a four-terminal line structure in which a pair of conductors are faced each other, having an impedance lower than that of a conductor connected to any terminal, and using a frequency band of an electromagnetic wave whose wavelength is shorter than a length approximately four times of the length of the circut device as an object frequency band is inserted into the transmission line and used as a low impedance device to the electromagnetic wave of the object frequency band.

Wide-band circuit coupled through a transmission line

An element of parallel flat plate line type suitable for operation at a higher speed and with a higher frequency is provided. The element is characterized by including a first metallic memberincluding a flat plate sectionand a projected sectionin which a plurality of projections are formed to stand on one surface of the flat plate sectionin a direction substantially vertical to the surface with gaps therebetween, a second metallic memberincluding a flat plate sectionand a projected sectionin which a plurality of projections are formed to stand on one surface of the flat plate sectionin a direction substantially vertical to the surface with gaps therebetween, and a dielectric filmformed between the projections and the gaps of the element of parallel flat plate line type formed by inserting the projections of the first metallic memberin the gap of the second metallic memberand inserting the projections of the second metallic memberin the gap of the first metallic member, wherein a transmission line is formed between the first metallic memberand the second metallic memberalong the dielectric film, the transmission line being formed to have transmittivity ranging from &#x2212;140 dB to &#x2212;20 dB for a high-frequency electromagnetic wave ranging from 100 kHz to 10 GHz supplied from one terminal.

Element of parallel flat plate line type, a circuit board

Transmission line type components (), which form coaxial lines having a very low characteristic impedance by coaxially installing a cylindrical outer conductor made of a conductive material being larger in diameter than an inner conductor so as to cover via a high dielectric insulating material the surface of an inner conductor made of a conductive material, are inserted in series between a power supply line () and a ground line () connected with a dc source on a printed circuit board and an I.SI () power supply port, whereby almost the entire high-frequency power supply current generated from the I.SI () is reflected off the I.SI () power supply port, and part of the high-frequency power supply current intruding into the components (') is consumed and does not reach the external power supply line ().

Coaxial line type components with low characteristic impedance

A circuit layout design method capable of an LSI circuit or an electronic printed circuit board free of electromagnetic interference is provided. The layout design method according to the invention includes a quasi-stationary circuit reduction step of deviding an entire circuit represented by a net list and a part library into a plurality of quasi-stationary closed circuits having a reduced size so that an intensity of an electromagnetic wave radiated from each of the quasi-stationary closed circuits is not more than a predetermined value; a wiring constraint condition calculation step of calculating constraint conditions for each of wirings mutually connecting the plurality of quasi-stationary closed circuits so that the intensity of the electromagnetic wave radiated from each of the wirings is not more than the predetermined value; and a layout step of laying out parts and the wirings based on the net list and the parts library so as to satisfy the constraint conditions.

Method and system for designing circuit layout

A decoupling device for decoupling a high-frequency noise wave in a digital circuit is formed as a line device including a portion of a semiconductor substrate, an insulator film formed thereon as a gate oxide film, and an interconnect line formed thereon as a gate electrode. The line capacitance between the interconnect line and the semiconductor substrate is 100 pF or above, whereby the decoupling device effectively decouples the electromagnetic noise wave generated by a switching device in a frequency range between 10 and 1000 GHz.

Low-impedance decoupling device

A method for generating thermal network data for use in thermal analysis of a coupling structure of a large number of components. Depending on the density of nodes having a position defined by the structure, two-dimensional quadtree area division or three-dimensional octtree area division is performed. A node is provided in the center of the divided area and anode is determined using approximation to a node having a position defined by the structure. Alternatively, an area and a node are determined using Voronoi area division in case of area subdivision where a small area is assigned only to a defined node. Thermal network data is generated by inserting thermal resistances between respective nodes.

System and method for generating thermal network data and recording medium

A dielectric oxide film is formed on the surface of a valve metal plate formed of aluminum and a conductive polymer layer is provided so as to cover the valve metal plate and the dielectric oxide film. The conductive polymer layer is formed of polyaniline having para-toluenesulfonic acid as a dopant. A conductive carbon paste layer and a silver paste layer are provided at the outer side of the conductive polymer layer and a metal plate, comprising a copper foil, is overlapped onto the silver paste layer. Anode lead terminals are connected to the ends of the valve metal plate and the respective end parts of the metal plate are arranged as cathode lead terminals. A shield strip line device, which is low in impedance, especially in high-frequency ranges of 100 MHz or more, and is favorably adapted to high speed and high frequencies, mainly for use as a bypass device for a noise filter or as a decoupling device, is thus obtained.

Growing community of inventors

Tokyo, Japan

Hirokazu Tohya