Hirokazu Imai is a prominent inventor based in Okazaki, Japan. He has made significant contributions to the field of conductive materials, holding a total of 7 patents. His work focuses on enhancing the performance and efficiency of electronic components through innovative conductor compositions and adhesives.

Latest Patents

Hirokazu Imai's latest patents include a conductor composition, a mounting substrate, and a mounting structure utilizing this composition. This conductor composition is designed to secure conductivity at levels comparable to silver bulk at low-temperature processes. The mounting structure connects electrodes of a substrate and surface mounting components through the conductor composition, which contains conductive particles made of low crystallized silver fillers with a crystal size of 10 micrometers or less. Another notable patent involves a conductive adhesive formed by mixing various conductive fillers into a thermosetting resin. This adhesive features a core material made of copper-based metal, coated with silver, and is designed to bond two members effectively.

Career Highlights

Hirokazu Imai is currently employed at Denso Corporation, where he continues to innovate in the field of conductive materials. His work has been instrumental in advancing technologies that improve the reliability and performance of electronic devices.

Collaborations

Hirokazu collaborates with talented coworkers, including Yuji Ootani and Masashi Totokawa, who contribute to the development of cutting-edge technologies in their field.

Conclusion

Hirokazu Imai's contributions to the field of conductive materials and adhesives highlight his role as a key innovator in the industry. His patents reflect a commitment to enhancing electronic component performance, making him a significant figure in modern technology.

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