The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 04, 2004
Filed:
Aug. 01, 2001
Kan Kinouchi, Okazaki, JP;
Mitsuhiro Saitou, Obu, JP;
Takashi Nagasaka, Anjo, JP;
Yuji Ootani, Okazaki, JP;
Hiroyuki Yamakawa, Okazaki, JP;
Koji Takeuchi, Nukata-gun, JP;
Hirokazu Imai, Anjo, JP;
Yukihiro Maeda, Kasugai, JP;
Atsushi Kanamori, Nukata-gun, JP;
Denso Corporation, Kariya, JP;
Abstract
Several electronic parts are mounted on several ceramic substrates in a semiconductor device, and are wire bonded to the respective ceramic substrates through bonding wires. The electronic parts and the bonding wires are covered with an enclosing member on every ceramic substrate, and an inside of the enclosing member is filled with silicone gel for sealing. The ceramic substrates are bonded to a radiation fin together, and are mounted on a motherboard perpendicularly to the motherboard.