Denso Corporation

Hirokazu Imai

Yuji Ootani

Masashi Totokawa

Takashi Nagasaka

Akira Shintai

Hirotsugu Takeuchi

Hiroshi Oshitani

Mitsuhiro Saitou

Yuji Honda

Koji Takeuchi

Atsushi Kanamori

Yasutomi Asai

Yukihiro Maeda

Hitoshi Ninomiya

Mika Saito

Katsuya Kusano

Yasunori Ninomiya

Yukinori Migitaka

Kan Kinouchi

Hiroyuki Yamakawa

A conductor composition being able to easily secure the conductivity at the same level as an Ag bulk at low temperature process, a mounting substrate utilizing the conductor composition and a mounting structure utilizing the conductor composition are provided. In a mounting structure, wherein one or more electrodes () of a mounting substrate () and one or more surface mounting components () are connected through a conductor composition (), and one or more surface wirings () of the mounting substrate (), one or more inner-layer wirings () and one or more via conductors () are formed with the conductor composition, the conductor composition contains conductive particles with electrical conductivity, and the conductive particles are composed of low crystallized Ag fillers with the crystal size of 10 &#x3bc;m or less.

Conductor composition, a mounting substrate and a mounting structure utilizing the composition

A conductive adhesive is formed by mixing a plurality of conductive fillers into a thermosetting resin. The conductive filler includes a core material made of copper-based metal, a coating film made of silver and a plurality of particles made of silver. The coating film is provided on the core material to cover the core material, and the particles are provided on a surface of the coating film. Accordingly, a surface of the core material is prevented from being exposed. The conductive adhesive can be suitably used for bonding two members.

Conductive adhesive, method of producing the same, and bonding method

A vapor-compression refrigerant cycle device includes an ejector, a first evaporator for evaporating refrigerant flowing out of a pressure-increasing portion of the ejector, a second evaporator for evaporating refrigerant to be drawn into a refrigerant suction port of the ejector. In the refrigerant cycle device, a refrigerant suction pipe is connected to a refrigerant outlet of the second evaporator and the refrigerant suction port of the ejector, and the surface of the refrigerant suction pipe is covered by an insulating member. Furthermore, the ejector, the first evaporator, the second evaporator and the refrigerant suction pipe are arranged in a passenger compartment of the vehicle.

Refrigerant cycle device for vehicle

A conductor composition being able to easily secure the conductivity at the same level as an Ag bulk at low temperature process, a mounting substrate utilizing the conductor composition and a mounting structure utilizing the conductor composition are provided. In a mounting structure, wherein one or more electrodes () of a mounting substrate () and one or more surface mounting components () are connected through a conductor composition (), and one or more surface wirings () of the mounting substrate (), one or more inner-layer wirings () and one or more via conductors () are formed with the conductor composition, the conductor composition contains conductive particles with electrical conductivity, and the conductive particles are composed of low crystallized Ag fillers with the crystal size of 10 nm or less.

Several electronic parts are mounted on several ceramic substrates in a semiconductor device, and are wire bonded to the respective ceramic substrates through bonding wires. The electronic parts and the bonding wires are covered with an enclosing member on every ceramic substrate, and an inside of the enclosing member is filled with silicone gel for sealing. The ceramic substrates are bonded to a radiation fin together, and are mounted on a motherboard perpendicularly to the motherboard.

Semiconductor device including bonded wire based to electronic part and method for manufacturing the same

A mounting structure includes a laminated ceramic capacitor mounted on a mounting substrate. The laminated ceramic capacitor includes a main body chip made by a ceramic dielectric, internal layer electrodes, and pair of terminal electrodes. The mounting substrate is made by alumina substrate, and has a pair of substrate electrodes made by copper plating. The laminated ceramic capacitor is mounted on the mounting substrate by using an Ag paste. Here, the substrate electrode is set to be smaller than the Ag paste. That is, the Ag paste is extruded from the terminal electrodes and the substrate electrode so as to contact to both of the main body chip and the mounting substrate. Because the Ag paste has a high adhesive strength compared to that when it is bonded with a metal, total adhesive strength can be improved. Consequently, the reliability of mounting can be improved.

Mounting structure of electronic parts and mounting method of electronic parts

A warning device for warning change time of a filter for cleaning air includes an indication lamp which indicates a warning of the change time of the filter, and a control unit for controlling operation of the indication lamp. The control unit sets a next timer setting value for the next filter change to a filter-using time until a change of the filter, and operates the indication lamp when the filter-using time passes the next timer setting value after the change of the filter. Thus, the warning of the change time of the filter is performed at a suitable moment reflecting a variation of a clogging degree of the filter. As a result, the warning device accurately performs the warning of the change time of the filer without using a sensor for detecting the clogging degree of the filter.

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Okazaki, Japan

Hirokazu Imai