The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 04, 2001

Filed:

Apr. 06, 1999
Applicant:
Inventors:

Yasutomi Asai, Okazaki, JP;

Hirokazu Imai, Anjo, JP;

Yuji Ootani, Okazaki, JP;

Takashi Nagasaka, Anjo, JP;

Assignee:

Denso Corporation, Kariya, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/328 ;
U.S. Cl.
CPC ...
H01L 2/328 ;
Abstract

A mounting structure includes a laminated ceramic capacitor mounted on a mounting substrate. The laminated ceramic capacitor includes a main body chip made by a ceramic dielectric, internal layer electrodes, and pair of terminal electrodes. The mounting substrate is made by alumina substrate, and has a pair of substrate electrodes made by copper plating. The laminated ceramic capacitor is mounted on the mounting substrate by using an Ag paste. Here, the substrate electrode is set to be smaller than the Ag paste. That is, the Ag paste is extruded from the terminal electrodes and the substrate electrode so as to contact to both of the main body chip and the mounting substrate. Because the Ag paste has a high adhesive strength compared to that when it is bonded with a metal, total adhesive strength can be improved. Consequently, the reliability of mounting can be improved.


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