The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 15, 2008
Filed:
Aug. 08, 2006
Yasunori Ninomiya, Kariya, JP;
Masashi Totokawa, Nagoya, JP;
Hirokazu Imai, Okazaki, JP;
Yukinori Migitaka, Kasugai, JP;
Yasunori Ninomiya, Kariya, JP;
Masashi Totokawa, Nagoya, JP;
Hirokazu Imai, Okazaki, JP;
Yukinori Migitaka, Kasugai, JP;
DENSO CORPORATION, Kariya, JP;
Abstract
A conductive adhesive is formed by mixing a plurality of conductive fillers into a thermosetting resin. The conductive filler includes a core material made of copper-based metal, a coating film made of silver and a plurality of particles made of silver. The coating film is provided on the core material to cover the core material, and the particles are provided on a surface of the coating film. Accordingly, a surface of the core material is prevented from being exposed. The conductive adhesive can be suitably used for bonding two members.