The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 05, 2010
Filed:
May. 17, 2007
Masashi Totokawa, Nagoya, JP;
Yuji Ootani, Aichi-pref., JP;
Hirokazu Imai, Okazaki, JP;
Akira Shintai, Chita, JP;
Masashi Totokawa, Nagoya, JP;
Yuji Ootani, Aichi-pref., JP;
Hirokazu Imai, Okazaki, JP;
Akira Shintai, Chita, JP;
DENSO CORPORATION, Kariya, JP;
Abstract
A conductor composition being able to easily secure the conductivity at the same level as an Ag bulk at low temperature process, a mounting substrate utilizing the conductor composition and a mounting structure utilizing the conductor composition are provided. In a mounting structure, wherein one or more electrodes () of a mounting substrate () and one or more surface mounting components () are connected through a conductor composition (), and one or more surface wirings () of the mounting substrate (), one or more inner-layer wirings () and one or more via conductors () are formed with the conductor composition, the conductor composition contains conductive particles with electrical conductivity, and the conductive particles are composed of low crystallized Ag fillers with the crystal size of 10 μm or less.