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For the Inventor, By the Inventor

Folsom, CA, United States of America

Hing Yan To

This inventor holds 28 USPTO granted patents and 4 published patent applications, primarily in Printed Circuit Design. Top assignees: Intel Corporation, Xilinx, Inc.. Active years: 2000-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hing Yan To. Retrieved from https://idiyas.com/inventor/hing-yan-to

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 28 

% Patents Active = 46.4

Average Co-Inventor Count = 2.4

ph-index = 10

Forward Citations = 235(Granted Patents)


Location History:

  • Folsom, CA (US) (2000 - 2008)
  • Cupertino, CA (US) (2005 - 2022)

Company Filing History:

goldMedal25 out of 56,290 
 
Intel Corporation
 patents
silverMedal3 out of 5,106 
 
Xilinx, Inc.
 patents

Years Active: 2000-2025

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Areas of Expertise:
Communication Bus
Integrated Circuit
Clock Synchronization
Memory Interface
Modular Design
I/O Bus Timing
Latency Normalization
Error-Nulling Calibration
Differential Interface
Data Signals
Voltage Glitch Reduction
Sense Amplifier
28 patents (USPTO):Explore Patents
1. 12476193 - Routing a communication bus within multiple layers of a printed circuit board (2025-11-18),
2. 11428733 - On-die virtual probes (ODVP) for integrated circuitries (2022-08-30),
3. 10860776 - Printed circuit board (PCB) modular design (2020-12-08),
4. 7954001 - Nibble de-skew method, apparatus, and system (2011-05-31),
5. 7805627 - Clock synchronization scheme for deskewing operations in a data interface (2010-09-28),
6. 7692457 - Dual-path clocking architecture (2010-04-06),
7. 7602859 - Calibrating integrating receivers for source synchronous protocol (2009-10-13),
8. 7459938 - Method and apparatus for power efficient and scalable memory interface (2008-12-02),
9. 7446572 - Method and system for a configurable Vcc reference and Vss reference differential current mode transmitter (2008-11-04),
10. 7401246 - Nibble de-skew method, apparatus, and system (2008-07-15),
11. 7388795 - Modular memory controller clocking architecture (2008-06-17),
12. 7334148 - Optimization of integrated circuit device I/O bus timing (2008-02-19),
13. 7324403 - Latency normalization by balancing early and late clocks (2008-01-29),
14. 7243176 - Method and apparatus for power efficient and scalable memory interface (2007-07-10),
15. 7194559 - Slave I/O driver calibration using error-nulling master reference (2007-03-20),

Title: Innovations and Contributions of Hing Yan To

Introduction

Hing Yan To, based in Folsom, CA, is an accomplished inventor with an impressive portfolio of 27 patents to his name. His work primarily focuses on advancements in integrated circuitry and printed circuit board design, contributing significantly to technological innovation in these fields.

Latest Patents

Among Hing Yan To's recent patents, two notable inventions stand out. The first is the development of **on-die virtual probes (ODVP) for integrated circuitries**. This invention enables measurement of voltages in integrated circuits, comprising a voltage-controlled frequency oscillator circuitry and a processor circuitry. The oscillator generates a frequency signal related to the supply voltage, while the processor identifies the relationship between frequency and voltage, thereby monitoring on-die transient voltages effectively.

Another significant invention is the **printed circuit board (PCB) modular design**. This innovative design system incorporates a processor and memory to create a user-friendly interface for multi-layered PCB design. It allows the insertion of layout templates into the workspace, streamlining the design process and enhancing functionality.

Career Highlights

Throughout his career, Hing Yan To has worked with prominent companies in the technology sector. Notably, he has held positions at **Intel Corporation** and **Xilinx, Inc.** These roles have provided him with the opportunity to develop and refine his innovations, contributing to advancements in semiconductor technology.

Collaborations

Hing Yan To has collaborated with talented professionals, including **James A. McCall** and **Joseph H. Salmon**. These partnerships have enriched his work and allowed for the exchange of ideas, driving further innovations in their respective fields.

Conclusion

Hing Yan To's contributions to the fields of integrated circuits and PCB design reflect his expertise and innovative spirit. With a robust portfolio of 27 patents, his work continues to influence technological advancements and inspire future inventors. His collaborations and experiences at leading technology companies have positioned him as a notable figure in the world of innovation.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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