Company Filing History:
Years Active: 2005-2023
Title: Innovations of Hing Leung Li
Introduction
Hing Leung Li is a notable inventor based in Hong Kong, CN. He has made significant contributions to the field of technology, particularly in the area of bonding devices. With a total of 3 patents to his name, his work has had a considerable impact on the industry.
Latest Patents
One of his latest patents is a force sensor in an ultrasonic wire bonding device. This innovative sensor is designed to determine the bonding force during wire bonding operations. It features a piezoelectric sensing element mounted in an ultrasonic transducer, which includes a first portion and a second portion with opposing surfaces. The first surface of the first portion has a positive electrode, while the second surface has a negative electrode. Conversely, the second portion has its surfaces configured oppositely.
Another significant patent is the flip chip bonding tool. This bonding tool and method facilitate the bonding of a semiconductor chip to a surface. The tool includes a bonding tip made from a ceramic material, preferably titanium carbide. This bonding tip is designed to hold the chip securely, while an ultrasonic transducer applies bonding energy to ensure a strong bond between the chip and the surface. The bonding tip may also incorporate martensite, allowing for a combination of hard and soft phases.
Career Highlights
Hing Leung Li has worked with reputable companies such as ASM Assembly Automation Limited and ASMPT Singapore Pte. Ltd. His experience in these organizations has contributed to his expertise in the field of bonding technologies.
Collaborations
Throughout his career, Hing has collaborated with talented individuals, including coworkers Ran Fu and Deming Liu. These collaborations have likely enriched his work and led to innovative solutions in his projects.
Conclusion
Hing Leung Li's contributions to the field of technology through his patents and collaborations highlight his role as a significant inventor. His work continues to influence advancements in bonding technologies, showcasing the importance of innovation in the industry.