The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 29, 2005
Filed:
Apr. 18, 2003
Applicants:
Hing Leung LI, Kowloon, HK;
Kelvin Ming Wai NG, Kowloon, HK;
Helen Lai WA Chan, Kowloon, HK;
Peter Chou Kee Liu, Kowloon, HK;
Inventors:
Hing Leung Li, Kowloon, HK;
Kelvin Ming Wai Ng, Kowloon, HK;
Helen Lai Wa Chan, Kowloon, HK;
Peter Chou Kee Liu, Kowloon, HK;
Assignee:
ASM Assembly Automation Limited, Kowloon, HK;
Primary Examiner:
Int. Cl.
CPC ...
B23K001/06 ; B23K005/20 ;
U.S. Cl.
CPC ...
Abstract
A transducer for a wire bonding apparatus is formed of two separate parts sandwiching therebetween a plurality of piezoelectric elements. One of the two parts is the amplifying horn, and by selecting appropriate sizes and shapes for the two parts, vibrational energy can be concentrated at the distal end of the amplifying horn where the bonding tool is located.