Asm Assembly Automation Limited

Asmpt Singapore Pte. Ltd.

Hing Leung Li

Deming Liu

Ran Fu

Helen Lai Wa Chan

Chi Chuen Chaw

Tsz Kit Yu

Hing Suen Siu

Kelvin Ming Wai Ng

Peter Chou Kee Liu

Ly Tat Peh

Hoi Ting Lam

A force sensor for determining a bonding force during wire bonding operations includes: a piezoelectric sensing element mounted in an ultrasonic transducer of an ultrasonic wire bonding device, the piezoelectric sensing element including a first portion and a second portion, and first and second opposing surfaces, wherein the first surface of the first portion has a positive electrode and the second surface of the first portion has a negative electrode respectively, and the first surface of the second portion has a negative electrode and the second surface of the second portion has a positive electrode respectively.

Force sensor in an ultrasonic wire bonding device

A bonding tool and method for bonding a semiconductor chip to a surface is provided wherein the bonding tool includes a bonding tip comprising a ceramic material, preferably titanium carbide. The bonding tip is operative to hold the chip and a bonding energy generator such as an ultrasonic transducer is coupled to the bonding tip for applying bonding energy to the bonding tip and the chip to bond the chip to the surface. The bonding tip may further include martensite such that the titanium carbide is present in a hard phase and the martensite is present in a soft phase as a binder for the same.

Flip chip bonding tool

A transducer for a wire bonding apparatus is formed of two separate parts sandwiching therebetween a plurality of piezoelectric elements. One of the two parts is the amplifying horn, and by selecting appropriate sizes and shapes for the two parts, vibrational energy can be concentrated at the distal end of the amplifying horn where the bonding tool is located.

Ultrasonic transducer

Growing community of inventors

Hong Kong, China

Hing Leung Li