The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 02, 2008
Filed:
Oct. 13, 2004
Ran Fu, Hong Kong, CN;
Deming Liu, Hong Kong, CN;
Chi Chuen Chaw, Hong Kong, CN;
Hing Leung LI, Hong Kong, CN;
Chak Hau Pang, Hong Kong, CN;
Hing Suen Siu, Hong Kong, CN;
Ran Fu, Hong Kong, CN;
Deming Liu, Hong Kong, CN;
Chi Chuen Chaw, Hong Kong, CN;
Hing Leung Li, Hong Kong, CN;
Chak Hau Pang, Hong Kong, CN;
Hing Suen Siu, Hong Kong, CN;
ASM Assembly Automation Ltd., Hong Kong, HK;
Abstract
A bonding tool and method for bonding a semiconductor chip to a surface is provided wherein the bonding tool includes a bonding tip comprising a ceramic material, preferably titanium carbide. The bonding tip is operative to hold the chip and a bonding energy generator such as an ultrasonic transducer is coupled to the bonding tip for applying bonding energy to the bonding tip and the chip to bond the chip to the surface. The bonding tip may further include martensite such that the titanium carbide is present in a hard phase and the martensite is present in a soft phase as a binder for the same.