Location History:
- Kwai Chung, CN (2007)
- Hong Kong, CN (2006 - 2008)
Company Filing History:
Years Active: 2006-2008
Title: The Innovative Contributions of Ran Fu
Introduction
Ran Fu is a notable inventor based in Hong Kong, CN. He has made significant contributions to the field of semiconductor technology, holding a total of 4 patents. His work focuses on enhancing the efficiency and reliability of semiconductor devices.
Latest Patents
One of his latest patents is for a leadframe comprising tin plating or an intermetallic layer formed therefrom. This patent describes a method of producing a leadframe that includes providing a substrate, plating it with a layer of tin, and then plating a layer of nickel over the tin. The process culminates in the creation of one or more intermetallic layers that impede the out-diffusion of copper from the base material of the leadframe to its surface. Another significant patent is for a flip chip bonding tool. This invention provides a bonding tool and method for attaching a semiconductor chip to a surface. The bonding tool features a ceramic bonding tip, preferably made of titanium carbide, which is designed to hold the chip while applying bonding energy through an ultrasonic transducer.
Career Highlights
Ran Fu is currently employed at Asm Assembly Automation Limited, where he continues to innovate in the semiconductor industry. His expertise and inventions have contributed to advancements in the manufacturing processes of semiconductor devices.
Collaborations
Ran Fu has collaborated with notable coworkers, including Deming Liu and Kui Kam Lam, who have also contributed to various projects within the company.
Conclusion
Ran Fu's innovative work in semiconductor technology and his impressive portfolio of patents highlight his significant role in advancing the industry. His contributions continue to influence the development of more efficient and reliable semiconductor devices.