The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 31, 2006
Filed:
Feb. 23, 2004
Deming Liu, Kwai Chung, HK;
Ran Fu, Kwai Chung, HK;
Kui Kam Lam, Kwai Chung, HK;
Man Chung Raymond NG, Kwai Chung, HK;
Wai Yuen Cheung, Kwai Chung, HK;
Deming Liu, Kwai Chung, HK;
Ran Fu, Kwai Chung, HK;
Kui Kam Lam, Kwai Chung, HK;
Man Chung Raymond Ng, Kwai Chung, HK;
Wai Yuen Cheung, Kwai Chung, HK;
ASM Assembly Automation Ltd., , HK;
Abstract
The invention provides an apparatus for die attachment onto a substrate including non-metallic material, and metallic material that is adapted to receive a die having a eutectic coating. A heating conduit is provided through which the substrate is movable for heating the metallic material to a eutectic bonding temperature to facilitate bonding between the die and the metallic material at a die-attach position. An induction heating device at the die-attach position heats the metallic material of the substrate to the eutectic bonding temperature prior to attaching a die onto the metallic material.