Company Filing History:

8 out of 1,801

Fujikura Limited

where one patent can have more than one assignee

Years Active: 2012-2021

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8 patents (USPTO):Sort by Forward Citations

Abstract keywords

1. 11178750 - Multilayer substrate, multilayer substrate array, and transmission/ reception module (2021-11-16),

2. 11018441 - Wireless module (2021-05-25),

3. 10386665 - Optical element package (2019-08-20),

4. 10295852 - Optical device and method for manufacturing optical device (2019-05-21),

5. 10139700 - Optical device (2018-11-27),

6. 9667843 - Imaging module, insulating-tube-attached imaging module, lens-attached imaging module, and endoscope (2017-05-30),

7. 8564101 - Semiconductor apparatus having a through-hole interconnection (2013-10-22),

8. 8273657 - Method for manufacturing a semiconductor apparatus having a through-hole interconnection (2012-09-25),

Title: The Innovative Journey of Inventor Hideyuki Wada

Introduction

Hideyuki Wada is a notable inventor based in Chiba, Japan, recognized for his contributions to the field of multilayer substrates and wireless modules. With a total of eight patents to his name, Wada has demonstrated a high level of ingenuity and technical skill in his inventions, reflecting the advancements in modern electronic technologies.

Latest Patents

Among his latest patents are the multilayer substrate, multilayer substrate array, and transmission/reception module. The multilayer substrate and the multilayer substrate array feature a high degree of freedom in production methods. A remarkable aspect of his multilayer substrate invention involves processing part of the outer periphery into a wave shape, allowing for optimized performance. Additionally, his wireless module achieves a high gain antenna while minimizing interference from radio waves generated by RFICs. This innovation incorporates multiple serial-type radiation element rows arranged in parallel, demonstrating Wada's commitment to advancing wireless communication technologies.

Career Highlights

Throughout his career, Hideyuki Wada has lent his expertise to several esteemed companies, including Fujikura Limited and Sony Corporation. His experience in these prestigious firms has undoubtedly influenced his innovative thinking and design approaches, propelling his inventions forward in an ever-evolving tech landscape.

Collaborations

Wada has collaborated with distinguished coworkers such as Yoshimichi Harada and Masami Suzuki. These partnerships have fostered an environment of creativity and technical excellence, allowing for the successful development of various advanced technologies that have impacted the industry.

Conclusion

Hideyuki Wada's contributions to the fields of multilayer substrates and wireless technologies exemplify his innovative spirit and technical acumen. His patents showcase not only his creativity but also his commitment to improving the efficiency and performance of modern electronic devices. As a recognized inventor, Wada continues to inspire future generations of engineers and inventors alike.

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